YCS R1 Pro

A high-performance tool tailored for mobile phone repair and SMD/BGA rework tasks:

🔥 High Power Output: 1000 W heating core for fast temperature ramp-up and efficient large-pad desoldering
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🌡️ Wide Temperature Range: 100 °C–550 °C (212 °F–1031 °F); fast and accurate heat control using intelligent curve and mode selection

Curve Mode for smooth temp transitions (prevents thermal shock)

Chip Modes: High‑wind for large pads; Low‑wind for delicate work

🎛️ Smart Features:

Removable armrest for ergonomic support

Smart sleep/wake via sensor on the stand

3 memory presets to recall temperature & airflow settings

📺 HD Color Display: Real-time view of temperature, airflow, and power output

💨 Adjustable Airflow: 1–200 units (≈ 50 L/min max) for precise control

⚙️ Included Accessories: Comes with 4 standard nozzles (5 mm, 10 mm, 12×17 mm, 13×13 mm)

🌎 Voltage Compatibility: AC 110 V/220 V—suits global use

📏 Build & Size: ~225×208×136 mm; ~2.9 kg

🧰 Why It’s Great for Technicians

Ultra-fast heating and intelligent temperature control reduce repair time

Versatile modes support both delicate and heavy-duty rework

Ergonomic design enhances comfort during extended usage

Memory presets enable workflow consistency across jobs